MIL-STD-810G
Low Temperature


Low temperatures have adverse effects on almost all basic hardware. Exposure of test items to low temperatures may either temporarily or permanently impair the operation by changing the physical properties of the hardware. Therefore, low-temperature testing must be considered whenever the item will be exposed to temperatures below standard ambient. Examples of some problems that may occur when exposed to cold temperatures include:

  • Hardening and embrittlement of hardware
  • Binding of parts from differential contraction of dissimilar hardware and the different rates of expansion of parts in response to temperature transients
  • Changes in electronic components (resistors, capacitors, etc.)
  • Stiffening of shock mounts
  • Cracking and crazing, embrittlement, change in impact strength and reduced strength
  • Static fatigue of restrained glass
  • Condensation and freezing of water

Trimble Juno® T41 tested to the Basic Cold (C1) standard of one 24-hour cycle at -30 °C (-22 °F).

Trimble Ranger™ 3 tested to the Severe Cold standard of one 24-hour cycle at -40 °C (-40 °F).

Trimble Nomad® 1050 tested to Procedure I, II, III -35 °C (-31 °F) operating, -40 °C (-40 °F) storage).

Trimble Kenai® tested to Procedure II, III -30 °C (-22 °F) operating; -40 °C (-40 °F) storage)

Trimble Yuma® 2 tested to Procedure I, II, III -30 °C (-22 °F) operating; -40 °C (-40 °F) storage)