MIL-STD-810G
Temperature Shock


Temperature shock tests are conducted to determine if the hardware can withstand sudden changes in the temperature of the surrounding atmosphere without experiencing physical damage or deterioration in performance.

As a result of exposure to sudden temperature changes, operation of the test item may be affected either temporarily or permanently. Examples of problems that could occur as a result of exposure to sudden changes in temperature are:

  • Shattering of glass
  • Binding or slackening of moving parts
  • Separation of constituents
  • Stiffening of shock mounts
  • Changes in electronic components
  • Electronic or mechanical failures due to rapid water or frost formation
  • Differential contraction or expansion of dissimilar hardware
  • Deformation or fracture of components
  • Cracking of surface coatings
  • Leaking of sealed compartments

Trimble Kenai®, Yuma® 2, Nomad® 1050, Juno® T41 and Ranger™ 3 passed the following test:

  • Procedure I: temperature shock tested using two thermal chambers set at -30 °C and 60 °C (-22 °F and +144 °F), with a four-hour minimum soak and a five-minute maximum transfer time between chambers. A total of four cycles are conducted through both chambers.